High-density silicon sensor matrix targets financial payment terminals, ATM upgrades, and secure electronic signature displays.
Volume manufacturing has commenced for the FC300 capacitive sensor chip. With a generous 20.32 x 25.40 mm active area, the sensor meets FBI Mobile ID FAP30 standards and provides exceptional dry and worn finger capture performance.FC300 Large-Format FAP30 Capacitive Sensor Chip Enters Mass Production
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